Webb大佬们这是什么颗粒啊..Samsung Part Number K4A8G085WE-BCRC Package Standard Monolithic 78-ball FBGA Die Density / Count 8 Gb E-die (Kevlar / 16 nm) / 1 die WebbTypical FBGA’s have ball counts that range from 25 to 529 solder balls. The typical FBGA ball pitch is 0.8 mm to 1.0 mm, although thinner versions of the FBGA such as the …
Package Application Note for FBGA Packages - Microchip …
Webb96-ball FBGA, 8mm x 14mm - SACQ VRP Note: 1. Not all options listed can be combined to define an offered product. Use the part catalog search on http://www.micron.com for … Webb8 jan. 2024 · Available RAM: 13462 Memory Threaded: 42373 Memory Read Cached: 31512 Memory Write: 8945 Memory Latency: 56 We tested the RAM with the processor overclocked to 4.2 Ghz, 1.35V and RAM overclocked to 3155 Mhz and we got mixed results without significant speed improvement. the getaway guys
Micron BGA Manufacturer
Webb30 juli 2024 · Package : Standard Monolithic 78-ball FBGA Die Density / Count : 4 Gb B-die (25 nm) / 1 die Composition : 512M x8 (32M x8 x 16 banks) Clock Frequency : 1200 MHz … MEMORY MODULE ----- Manufacturer : G.Skill Series : Trident Z Part Number : F4 … Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines … Add Your Own Comment - Ryzen DRAM Calculator 1.3.1 by 1usmus Released … Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines … Nah, tenía la idea de salirme del Core i3 e ir directamente a gama media-alta (un … Just thought I'd let those of you following me know that I'll not be around here … Hey. How much for the FX 60 you're going to sell me? I'm interest in DDR and AGP. I … As many threads seem to get side-tracked with general discussion about cryptocoin, … Webb• JEDEC-standard ballout • Low-profile package • TC of 0°C to 95°C – 0°C to 85°C: 8192 refresh cycles in 64ms – 85°C to 95°C: 8192 refresh cycles in 32ms Options Marking • Configuration – 64 Meg x 16 x 8 banks x 2 ranks 1G16 • FBGA package (Pb-free) – 96-ball FBGA (9.5mm x 14mm x 1.2mm) DGA • Timing – cycle time1 WebbPart Number : K4A8G085WB-BCPB Package : Standard Monolithic 78-ball FBGA Die Density / Count : 8 Gb B-die (Boltzmann / 20 nm) / 1 die Composition : 1024Mb x8 (64Mb … the arbuckle project maintenance complex